About
MEMS Foundry
Packaging
Metrology & Test
Trusted Foundry

World-Class MEMS Foundry

Global Leader in smart innovation and manufacturing

This facility creates a vertically integrated “one-stop-shop” positioning New York State as the global leader in smart system and smart device innovation and manufacturing. These capabilities are unmatched the world over, providing the capacity, infrastructure and operational capabilities to create immediate job and investment opportunities in all areas of semiconductor and advanced manufacturing, covering a diverse number of markets including aerospace, biomed, communications, defense, and energy.

Largest array of world-class MEMS related solutions

Located just outside of Rochester, NY, Akoustis’ 120,000-square-foot, state-of-the-art facility includes over 26,000 square feet of certified cleanroom space with 150mm MEMS foundry services, complemented by a dedicated 8,000-square-foot MEMS and optoelectronic packaging facility. Akoustis offers the largest array of world-class MEMS related solutions from design to fabrication, packaging and testing, all under one roof.

Industry veterans, with strong backgrounds in guiding programs

Akoustis’ experienced team is focused on meeting customer’s demands for timely and high quality production of prototype to mid-volume MEMS solutions. The Akoustis team consists of industry veterans, with strong backgrounds in guiding programs through the difficult stages of product commercialization, and proven skills in developing innovative MEMS fabrication and packaging processes that ensure product success.

Quality Management System

The Quality Management System (QMS) is ISO 9001:2008 certified for the design, development, fabrication and packaging of MEMS and Semiconductor Devices.

Akoustis first became certified, after successfully passing the certification audit, on January 27, 2012. On July 27, 2012, an expansion audit successfully added Design to the scope of our registration. Since the original certification audit, Akoustis has passed six surveillance audits.

MEMS Foundry
Akoustis offers 150-mm MEMS production capabilities to meet our customer's needs for prototype, pilot, low- and mid-volume manufacturing.

Akoustis offers 150-mm MEMS production capabilities to meet our customer’s needs for prototype, pilot, low- and mid-volume manufacturing. Our facility is designed to provide maximum flexibility for a wide array of programs and substrate materials including silicon, quartz, metal and polyimides.

Akoustis utilizes the best available microfabrication approaches and production equipment to solve complex challenges in the areas of inertial sensors, biomedial, microfluidics, green technologies, optical displays, SiOB/Thermal Imaging, 3-D integration and wafer-level packaging. Our skilled team can provide support for process transfers / integration where required.

Plasma Etch

  • STS ASE DRIE
  • STS Pegasus DRIE
  • LAM DSIE
  • LAM 9400
    • Si, Polysilicon,.Polyimide, SiO2, TiO2
  • LAM 9600
    • Al, AlSiCu, AlSi, Ti, W, Ta, TiO2, SiO2, HfO2, Cr, Mo, AIN
  • LAM 4520
    • SiN, SiO2

Chemical Vapor Deposition (CVD)

  • Bruce Technologies BDF-200, MRL SBR1504
    • Atmospheric and Low Pressure
    • Thermal Oxidation
    • POCI3 Doping
  • LPCVD
    • Silicon Nitride
    • Polysilicon
  • Applied P5000, 3 DxZ chambers and Centura:
    • SiO2, SiN, Oxynitride, a-Si, TEOS
    • Low temperature SiO2 and SiN

Physical Vapor Deposition (PVD)

  • Sputter – Veeco Connexion 8 (DC and RF) and AMAT Endura (DC)
    • Ti, TiW, Ta, Mo, ITO, Al, AlSi, AlSiCu, SiO2, Al203, AIN
  • E-beam Metals Evaporation – Temescal FCE-2700A
    • Cr, Au, Mo, Al, Ni, Sn, Pt, Ti, Ag
  • Cambridge Nanotech Savannah 200ALD
    • Al203

Resist Strip

  • Ulvac and LAM downstream Microwave O2 Plasma strip
  • Piranha
  • EKC 265

Sacrificial Releases

  • Xactix XeF2
  • Primaxx HF Vapor
  • Ulvac O2 Polymer Release
    • Setup for 6” wafer robotic handling

Wet Processing

  • JST Wet Benches and SEMI SRDs
    • HF, BOE, Hot Phosphoric, KOH, Metal Etch (Al, Cr, Ti, TiW, Ni, Au), ITO etch, Piranha, EKC 265, NMP Lift-off, RCA

CMP /Grind

  • CMP – Strasbaugh 6EC
  • Polysilicon, SiO2, Si Smoothing
  • Strasbaugh nGenuity 7AAII
  • Silicon Wafer grinding
  • OnTrack DSS200
    • CMP wafer Scrubber
PACKAGING
Providing the optimal working environment and creating robust interfaces between a device and the external world.

Packaging is the key to ultimate MEMS success – providing the optimal working environment and creating robust interfaces between a device and the external world. At Akoustis our experienced team and cutting edge tool set provides cutting-edge wafer level packaging and 3-D integration at the device and wafer level. The power of our co-located wafer foundry and packaging facilities provide a vertically integrated resource that addresses customer’s needs.

Housed in a Class 100/ Class 1000 clean space, Akoustis’ packaging lab is designed to offer solutions that optimize critical small form factors, cost, performance and reliability.

Dicing

  • ADT 7200 Automated Dicing Saw
    • Dice substrates up to 12”
    • Available kerf widths down to 50µm
    • Glass, Si, Plastic
    • Taping and detaping unit
    • Integrated and atomized wafer cleaning

Plasma Processing/Cleaning

  • Oxford Plasmalab 80 Plus-RIE System
  • UV/Ozone cleaning
  • JST Solvent, Acid and Base Benches
  • Branson Etcher

Hermetic Package Sealing

  • SSEC dry box
    • Resistive weld seam sealer
    • Resistive weld solder

Wire Bonding

  • H&K BJ815
    • 12.3” X 7.0” work area
    • Fine pitch capability 40 µm
    • Au and Al wire
  • K&S 4700
    • Ball-Wedge bonding
    • 90 degree deep access wedge bonding 12.5mm ‘Z’ axis travel

Flip Chip/Die Bonding

  • Suss Microtec FC150
    • 1µm accuracy placement
    • 100kg max. force
    • Max T= 450C
    • Handle die from 250µm to 50mm
    • Handle substrates from 250µm up to 6” wafers

Adhesive Dispensing

  • Asymtek Spectrum S820
    • Precise volume and position
    • Automated fluid dispensing

Wafer-Scale Bonding

  • Anodic, thermocompression, glass frit, eutectic, fusion, adhesive
  • Suss Automated Bond Cluster – ABC200
    • Automated bond aligner with 1-3µm post clamp alignment capability
    • Atmospheric plasma activation
    • Megasonic cleaning
    • Substrate bonder
      • 500C temperature capability
      • 20 kN bond force
      • 5E-5 – 3000 mbar chamber pressure capability
  • Suss Manual Bond: SB6/BA6
  • HTI-7 Glass Frit Screenprinter
METROLOGY & TEST
At Akoustis, we monitor all clean room activity with the goal of achieving superior product yields. Equally important, both general and specific device tests systematically ensure high quality MEMS that satisfy customer needs.

At Akoustis, we monitor all clean room activity with the goal of achieving superior product yields. Equally important, both general and specific device tests systematically ensure high quality MEMS that satisfy customer needs.

During process development and optimization, Akoustis uses optical and scanning electron microscopy plus electrical and electronic measurement capabilities, paying careful attention to specific application requirements. To ensure production repeatability, Akoustis employs a full complement of in-line metrology equipment to routinely monitor each of the critical parameters that affect performance and quality.

Alpha Step Profilometers

  • KLA Tencor P-10 & P15

CD Measurement/ Elemental Analysis

  • Hitachi FESEM with EDAX

CD Overlay

  • IVS 135 CD Overlay

CD Scope

  • Nikon Eclipse 200

Electrical Characterization

  • MDC CV Tester
  • Suss Probe Station

Film Thickness and Stress

  • Woolam Ellipsometer
  • N&K 1500
  • Nanospec 210
  • Flexus 2620

Optical Profiling

  • ZYGO Optical Interferometer

Photoresist Thickness

  • Filmetrics F50

Surface Resistivity

  • CDE Resmap 16

Wafer Thickness

  • MTI Autoscan 200

Wire Bond Tester

  • Dage Precision Industries 4000
    • Wire Bond Pull and Shear Tester
TRUSTED FOUNDRY
One of only two accredited organizations that can provide integration of Trusted IC with MEMS.

Akoustis Trusted Foundry Services

Akoustis is one of only 4 companies in the nation accredited through the Defense Microelectronics Activity (DMEA) Trusted Foundry program for CMOS post-processing, and one of only two accredited organizations that can provide integration of Trusted IC with MEMS. The facility is also accredited for trusted aggregation, packaging, and assembly services.

Akoustis can provide defense, intelligence and other U.S. government agencies, and federal prime contractors with access to an array of services in a cleared, 120,000 square foot facility.  Akoustis maintains over 30,000 square feet of Class 100, Class 1000 and Class 10000 cleanrooms designed for low to mid-volume MEMS manufacturing and packaging/assembly services for 6” substrates, including silicon, quartz, glass, and specialty materials.

Click for PDF document

Click for PDF document

For more information on how you can utilize Akoustis’ accredited Trusted services, please contact us at trusted@akoustis.com.